Browse our range of high-quality products below.
Nickel Leveller 44 creates ultra-smooth, defect-free finishes by improving metal distribution, minimizing roughness, and delivering consistent, high-gloss nickel plating results.
Nickel Additive 42 enhances brightness, smoothness, and leveling in nickel plating, delivering flawless finish, improved durability, and consistent high-quality electroplating results.
Stannobrite SN 21 Brightner is a premium tin plating additive delivering high brightness, smooth deposits, improved leveling, and consistent electroplating performance.
Micro Mist MSL is an effective fume suppressant that controls acid mist, enhances workplace safety, improves air quality, and ensures smoother electroplating operations.
Cuprobrite 3006 Make Up is a specialized copper plating additive ensuring uniform deposition, excellent brightness, improved leveling, and stable bath performance.
Micro Mist L is an advanced fume suppressant that reduces mist formation, improves air quality, enhances safety, and supports efficient electroplating operations.
Styrobrite Salt K is a high-quality electroplating chemical providing bright finish, uniform coating, improved leveling, and enhanced performance for consistent plating results.
Strike Silver Salt 130 is a premium electroplating chemical ensuring excellent adhesion, uniform silver deposition, high conductivity, and superior surface finish quality.
Mist Free Liquid is a high-performance additive that minimizes fumes, improves workplace safety, enhances plating efficiency, and ensures a cleaner electroplating environment.
GICTANE 70 is a high-performance electroplating additive designed to improve brightness, leveling, and uniform metal deposition for superior finishing quality.
Uniglo Brightner AU is a gold plating additive that enhances brightness, improves deposit uniformity, and ensures smooth, high-quality, decorative finishes.
Surfix Strip 801 is an effective stripping solution designed for removing metal coatings, ensuring clean surfaces and preparing substrates for re-plating processes.
